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  Molded Interconnect Devices
ITB studies the possibility of using MID-technology in there molding processes.
The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: 3-D Molded Interconnect Devices (3-D MID).

MIDs are injected molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer a remarkable improved ecological behaviour in comparison to conventional printed circuit boards, they will however not replace but complement.

Key markets for the MID-technology are automotive electronics and telecommunication; besides those, MIDs are also suitable for computers, household appliances or medical technology.
The market is currently showing an annual growth rate of about 20%.
This page, together with the information about competent suppliers, wants to introduce this innovation to potential users and provide an easy way of understanding MID technology.

Molded Interconnect Devices




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