ITB studies the possibility of using MID-technology in there molding
| Molded Interconnect Devices|
The use of high temperature thermoplastics and their structured
metallization opens up a new dimension of circuit carrier design to the
electronic industry: 3-D Molded Interconnect Devices (3-D MID).
MIDs are injected molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer a remarkable improved ecological behaviour in comparison to conventional printed circuit boards, they will however not replace but complement.
Key markets for the MID-technology are automotive electronics and telecommunication; besides those, MIDs are also suitable for computers, household appliances or medical technology.
The market is currently showing an annual growth rate of about 20%.
This page, together with the information about competent suppliers, wants to introduce this innovation to potential users and provide an easy way of understanding MID technology.